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Power chips are attached to outside circuits with product packaging, and their efficiency depends upon the support of the packaging. In high-power situations, power chips are typically packaged as power modules. Chip affiliation refers to the electrical connection on the top surface area of the chip, which is normally light weight aluminum bonding cord in standard modules. ^
Standard power module package cross-section

Presently, business silicon carbide power components still mainly utilize the packaging modern technology of this wire-bonded traditional silicon IGBT component. They face issues such as large high-frequency parasitic parameters, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation toughness, which limit using silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these issues and fully exploit the substantial prospective advantages of silicon carbide chips, lots of new product packaging technologies and remedies for silicon carbide power components have arised over the last few years.

Silicon carbide power component bonding method


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold wires to copper cables, and the driving force is price reduction; high-power gadgets have created from aluminum cords (strips) to Cu Clips, and the driving force is to enhance item efficiency. The better the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging techniques, Cu Clip technology has the adhering to benefits:

1. The link in between the chip and the pins is constructed from copper sheets, which, to a particular extent, replaces the standard wire bonding method in between the chip and the pins. Consequently, an one-of-a-kind bundle resistance worth, greater present circulation, and better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can completely save the expense of silver plating and inadequate silver plating.

3. The item appearance is completely regular with normal items and is mainly utilized in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding method is extra costly and complicated, but it can attain better Rdson and much better thermal effects.


( copper strip)

Copper sheet plus cable bonding approach

The resource pad makes use of a Clip technique, and the Gate uses a Cable approach. This bonding method is somewhat cheaper than the all-copper bonding approach, conserving wafer area (applicable to really small entrance areas). The process is easier than the all-copper bonding technique and can obtain better Rdson and much better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper flashing, please feel free to contact us and send an inquiry.

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